Buy GEIA HB (R) Technical Guidelines For Aerospace And High Performance Electronic Systems Containing Lead-Free Solder And Finishes. Find the most up-to-date version of GEIA-STD at Engineering TechAmerica GEIA-HB Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder.
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Having started out as a “laundry list” of Pb-free concerns and challenges identified by the ADHP industry, the guide is structured such that those “delta” considerations, i. Standards Subscriptions from ANSI provides a money-saving, multi-user solution for accessing standards.
Pulse plating could be used as a means of manipulating the grain structure and orientation of the tin deposit, and in some instances showed reduced whisker growth compared with direct current deposits. The name was chosen around by a group of engineers from aerospace, h, and harsh environment ADHE organizations.
But, because of RoHS legislation, increasing numbers of components were only available with pure tin finishes. The deposit characteristics studied were thickness, grain size, morphology, orientation, intermetallic formation and elemental diffusion effects, under varying conditions of temperature, humidity, thermal cycling and applied external stress.
Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1
A distinguished group of experts gathered at Loughborough University in the East Midlands of the UK to share their knowledge with a room-full of engineers from the defence, aerospace and high-reliability electronics sector, at a seminar organised by SMART Group. If the document is revised or amended, you will be notified by email. Using a tin plating process deliberately chosen for it high propensity to whiskering, NPL had developed a parallel plate test vehicle that had been enabled electrical detection of failure.
Upon geiw these plans, several research consortiums and organizations embraced the plan and, to date, have addressed many of the technical needs although the significant effort of obtaining sufficient data to develop Pbfree reliability models still remains unanswered . With Professor Geoff Wilcox taking over as moderator, Charles Cawthorne began his own presentation by remarking that, 00005 first observed inand despite many years of study, the mechanism of tin whiskering was still not fully understood and predictive modelling was not yet possible.
While the Pb-free movement may appear ominous and challenging, there are tools and resources available to the designer. Trends for Printing Ultra Miniature Chips.
Finishes to be avoided were silver, plated tin-copper, any tin plating over brass without a copper or nickel barrier, and bright tin. And he quoted instances of systems failure in communications satellites giea from tin whiskers. This standard is not included in any packages.
Cawthorne reviewed the definitions of the mitigation control levels defined in GEIA-STD, commenting that the gria level would normally be a function of the design authority in consultation with the customer, and that military applications would typically expect mitigation to at least Level 2B—risks managed primarily through mitigations, including design rules, and more likely 2C—risks managed more by avoidance and less by mitigation.
A Circuitnet Media Publication.
Living With PB-Free in High Performance Engineering Design
Although higher currents would cause instant burn-out, in high-vacuum conditions a short circuit could result in a plasma discharge.
Charles Cawthorne then introduced Dr Mark Ashworth of Loughborough University, who discussed the effect of plating methodologies, gea first of two presentations describing research carried out at Loughborough into mechanisms and strategies for tin whisker mitigation.
As Pb-free technology increasingly becomes 0050 standard for electronic interconnects and finishes, engineers must cope with 000 various challenges posed by this material. Plated brass, tin-plated brass with a copper barrier layer, tin plated steel, tin-plated steel with a copper barrier layer, all displayed their own characteristics, sometimes predictable, sometimes not, but fused tin plating showed no whisker nucleation on any of these substrates during the 32 years of the study.
Summarizing at a high level, these challenges represent risks associated with 1 durability of the interconnection and 2 deleterious effects of tin whiskers. The plan included a list of tasks necessary to provide ADHP engineers sufficient information to minimize risks associated with Pb-free solders and finishes. Already Subscribed to this document. Tin Whisker Mitigation Methodologies: The higher current densities tended to favour the formation of large eruptions, rather than filament whiskers.
Your Alert Profile lists the documents that will be monitored. Whisker growth was reduced by increasing deposit thickness and by deposition at higher current densities. The assemblies were constantly monitored at a test voltage of 15 volts with a series resistor to limit current to 15 milliamps. Engineers will need to “act like engineers” in order to comprehend this information and apply it to their needs. Since the introduction of the RoHS legislation inthe threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry.
There had been a move away yb component termination material type, structure and processing as specific mitigation strategies. A remarkable observation was hh in some instances gei could be several years before whiskers began to grow, depending on the substrate and stress level. Nine batches had been built to date, together with control assemblies with no coating, all of which had shown extensive whiskering before any evidence was seen on the coated examples.
But how do we set about mitigating against such failure where the use of pure tin finished components is unavoidable? Finally, a good number of texts and a continuously increasing amount of data is now geiw in the open beia.
Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1
In summary, as the standards had evolved, they had become increasingly definitive with regard to component-to-component spacing design rules. He went on to discuss the detail requirements of Levels 2B, 2C and 3, with particular reference to bb use of conformal coatings to form a physical barrier. A proprietary bright tin plating process was used.
Other resources include work performed in to benchmark the Pb-free technical knowledge base as well as develop a roadmap and plan to close those technical data gaps [13, 14].
It was intended to continue ageing the test vehicles and review failures after a further six months, and to visually inspect the assemblies again after twelve months, also to build control assemblies to investigate the effect of temperature during coating. An additional test vehicle had been designed, based on a PCB with 24 SOIC14 packages, assembled using range of techniques, to enable testing for short circuits between adjacent leads on individual component.
Some key resources include the following set of standards and handbooks developed for working geiw Pb-free materials in various electronics applications: Subscription pricing is determined by: The space environment presented particular challenges to electronic systems: Strategies were now based on protective barriers, re-finishing of component terminations, and automatic coverage of pure tin finished surfaces by tin-lead solder during the assembly process.
The focus is to provide insight and information such that the design will maintain performance requirements for aerospace, defense, and high-performance ADHP products and systems.
He distributed copies to delegates, and it is available on-line for free download by clicking here. The body configuration of SMT electrolytic capacitors results in the solder joints being only partially visible for optical inspection purposes. Proceed to Checkout Continue Shopping.
He began his presentation on problems associated with whisker growths with a remarkable time-lapse video recorded by researchers at Brown University, showing the initiation and growth of a tin whisker at a steady rate of about 1 micron per hour over a period of 40 hours.